Sil-Pad® 2000

PROPERTY  IMPERIAL VALUEMETRIC VALUE TEST METHOD
 ColorWhiteWhiteVisual
 Reinforcement Carrier FiberglassFiberglass -
 Thickness (inch) / (mm) 0.010 to 0.020 0.254 to 0.508 ASTM D374
 Hardness (Shore A) 90 90ASTM D2240
 Continous Use temp (°F) / (°C)-76 to 392-60 to 200-
 ELECTRICAL
 Dielectric Breakdown Voltage (Vac) 40004000ASTM D149
 Dielectric Constant (1000 Hz)4 4.0ASTM D150
 Volume Resistivity (Ohm-meter) 10 111011ASTM D257
 Flame RatingV-OV-O U.L.94
  THERMAL
 Thermal Conductivity (W/m-K) 3.53.5 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE     
 Pressure (psi) 1025 50100200
 TO-220 Thermal Performance (°C/W) 2.612.32 2.021.65 1.37
 Thermal Impedance (°C-in 2 /W) (1) 0.57 0.43 0.38 0.35 0.30

1) The ASTM D5470 test fixture was used.  The recorded value includes iinterfacial thermal resistance.  These values are provided for reference only.  Actual application perfomance is directly related to the surface roughness, flatness, and pressure applied.

Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding aerospace and commercial applications.

Sil-Pad2000 is a silicone elastomer formulated to maximize the thermal and dielectric performance of the filler/ binder matrix. The result is a grease-free conformable material capable of meeting or exceeding the thermal and electrical requirements of high-reliability electronic packaging applications.

Features and Benefits:

  • Thermal impedance 0.38°C-in2 /W (@50 psi)
  • Optimal heat transfer
  • High Thermal conductivity: 3.5 W/m-k

Typical Applications:

  • Aerospace
  • Avionics
  • Motor Controls
  • Power Semiconductors
  • Power Supplies
  • U. L. File Number E59150

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